Tech

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ASML Holding N.V. ASML is increasingly benefiting from the growing adoption of AI, rapid advances in leading-edge Logic and Memory technologies and the need for sophisticated semiconductor manufacturing processes. The company is one of the biggest beneficiaries of the increasing technology complexity of the semiconductor ecosystem, which is driving demand for its lithography equipment.

AI Boom Fuels Advanced Logic & Memory Demand

Rapid expansion of AI infrastructure is one of ASML’s most powerful growth catalysts. Training and inference workloads require increasingly powerful and energy-efficient processors, which are accelerating the transition toward smaller process nodes and more advanced memory technologies.

The ongoing investments and continued progress in AI technologies are further boosting demand for both advanced Logic and Memory chips. Semiconductor manufacturers are accelerating capacity expansion plans, resulting in stronger commitments across ASML’s product portfolio.

Growing demand for high-bandwidth memory alongside tighter supplies of conventional DRAM is encouraging memory manufacturers to build additional capacity. At the same time, migration toward advanced DRAM nodes requires greater lithography intensity, benefiting both extreme ultraviolet (EUV) and deep ultraviolet (DUV) immersion demand.

Near-term trends remain equally encouraging. ASML now expects to ship approximately 65 Low-NA EUV systems in 2026, supporting year-over-year EUV net system sales growth of more than 45%. The rising contribution of EUV should also benefit ASML as semiconductor customers continue pushing their technology roadmaps forward to meet the performance and power-efficiency requirements of AI computing.

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Capacity Expansion Bodes Well

ASML’s decision to materially increase manufacturing capacity provides another indication of strengthening demand visibility. Based on strong customer commitments, the company plans to increase its 2027 Low-NA EUV capacity by approximately 30% from its 2026 capacity of roughly 65 systems. It is also evaluating another approximately 30% capacity increase for 2028.

A similar expansion is underway for immersion DUV. ASML plans to raise capacity by approximately 30% in 2027 from a 2026 level of roughly 130 systems and is evaluating another 30% increase for 2028. These initiatives are particularly encouraging because lithography systems have long production lead times and require close coordination with customers and ASML’s extensive supply chain. Capacity expansion therefore suggests that customers are providing ASML with increased visibility into their multi-year fab and technology plans.

The broader semiconductor industry’s long-term expansion provides an attractive backdrop for ASML. The increasing semiconductor content required for AI, cloud computing, automotive applications and other digital technologies should support additional wafer capacity and technology investments.

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